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SMC-231

SMC-231

SMC-231

REACH RoHS ELV
Card installation method Self-eject type
Card insertion detection With detection PIN
Product Type MICRO SIM

Basic Parameters

Snap Gauge MICRO SIM
Height Above Board 1.43mm
Card installation method PUSH PUSH Self-eject type
Locating Pin None
Foolproof Foolproof
Anti-Buckling Anti-collapse
Hot Swap Support/Normally closed
Temperature resistance 260℃
Package SMD
Packaging Method Tape and Reel

Mechanical Properties

Durability 5,000Cycle

Electrical Characteristics

Withstand Voltage 500V AC
Insulation Resistance 1000MΩ Min
Contact Resistance 100mΩ Max
Rated Current 0.5A
Rated Voltage 50V
Declaration:About Product Specifications、Parameter、Life、Operating Temperature、Waterproof Rating and Other Data，Only Represents XunPuInternal Test Results，For Detailed Test Methods，Please Contact XunPuSales Representative。

Product Part Number List

Product Image Part Number Product Description Product Documentation Production Status PINNumber Card insertion detection Delivery Cycle Product Gross Weight MPQ MOQ Remarks Actions
SMC-231-ARP7 SMC-231-ARP7

View Drawings

3DDownload

 		In Production 7PIN With detection 5-7Day 1.19Gram(g) 1500/plate No Restriction Contact Customer Service

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Product Parameter Information

Basic Parameters

Snap GaugeMICRO SIM
Height Above Board1.43mm
Card installation methodPUSH PUSH Self-eject type
Locating PinNone
FoolproofFoolproof
Anti-BucklingAnti-collapse
Hot SwapSupport/Normally closed
Temperature resistance260℃
PackageSMD
Packaging MethodTape and Reel

Mechanical Properties

Durability5,000Cycle

Electrical Characteristics

Withstand Voltage500V AC
Insulation Resistance1000MΩ Min
Contact Resistance100mΩ Max
Rated Current0.5A
Rated Voltage50V