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SIM-100

SIM-100

SIM-100

REACH RoHS ELV
Card installation method Simple type
Card insertion detection Without detection pin
Product Type MINI SIM

Basic Parameters

Snap Gauge MINI SIM
Height Above Board 1.90mm
Card installation method BLOCK Card core
Locating Pin None
Foolproof Not foolproof
Anti-Buckling Anti-collapse
Hot Swap Unsupported
Temperature resistance 260℃
Package SMD
Packaging Method Tape and Reel

Mechanical Properties

Durability 5,000Cycle

Electrical Characteristics

Withstand Voltage 500V AC
Insulation Resistance 1000MΩ Min
Contact Resistance 100mΩ Max
Rated Current 0.5A
Rated Voltage 50V
Declaration:About Product Specifications、Parameter、Life、Operating Temperature、Waterproof Rating and Other Data，Only Represents XunPuInternal Test Results，For Detailed Test Methods，Please Contact XunPuSales Representative。

Product Part Number List

Product Image Part Number Product Description Product Documentation Production Status PINNumber Card insertion detection Delivery Cycle Product Gross Weight MPQ MOQ Remarks Actions
SIM-100-ARP6 SIM-100-ARP6

View Drawings

3DDownload

 		In Production 6PIIN Without detection 3~15Day 0.5Gram(g) 1200pcs/plate No Restriction Contact Customer Service

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Product Parameter Information

Basic Parameters

Snap GaugeMINI SIM
Height Above Board1.90mm
Card installation methodBLOCK Card core
Locating PinNone
FoolproofNot foolproof
Anti-BucklingAnti-collapse
Hot SwapUnsupported
Temperature resistance260℃
PackageSMD
Packaging MethodTape and Reel

Mechanical Properties

Durability5,000Cycle

Electrical Characteristics

Withstand Voltage500V AC
Insulation Resistance1000MΩ Min
Contact Resistance100mΩ Max
Rated Current0.5A
Rated Voltage50V