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SIM-108

SIM-108

SIM-108

REACH RoHS ELV
Card installation method Flip cover type
Card insertion detection Without detection pin
Product Type MINI SIM

Basic Parameters

Snap Gauge MINI SIM
Height Above Board 2.50mm
Card installation method HINGE Flip open to remove card
Locating Pin None
Foolproof Foolproof
Anti-Buckling Anti-collapse
Hot Swap Unsupported
Temperature resistance 260℃
Package SMD
Packaging Method Tape and Reel

Mechanical Properties

Durability 5,000Cycle

Electrical Characteristics

Withstand Voltage 500V AC
Insulation Resistance 1000MΩ Min
Contact Resistance 100mΩ Max
Rated Current 0.5A
Rated Voltage 50V
Declaration:About Product Specifications、Parameter、Life、Operating Temperature、Waterproof Rating and Other Data，Only Represents XunPuInternal Test Results，For Detailed Test Methods，Please Contact XunPuSales Representative。

Product Part Number List

Product Image Part Number Product Description Product Documentation Production Status PINNumber Card insertion detection Delivery Cycle Product Gross Weight MPQ MOQ Remarks Actions
SIM-108-ARP6 SIM-108-ARP6

View Drawings

3DDownload

 		In Production 6PIN Without detection 3~7Day 800/plate No Restriction Contact Customer Service

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Product Parameter Information

Basic Parameters

Snap GaugeMINI SIM
Height Above Board2.50mm
Card installation methodHINGE Flip open to remove card
Locating PinNone
FoolproofFoolproof
Anti-BucklingAnti-collapse
Hot SwapUnsupported
Temperature resistance260℃
PackageSMD
Packaging MethodTape and Reel

Mechanical Properties

Durability5,000Cycle

Electrical Characteristics

Withstand Voltage500V AC
Insulation Resistance1000MΩ Min
Contact Resistance100mΩ Max
Rated Current0.5A
Rated Voltage50V