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TF-101B

TF-101B

TF-101B

REACH RoHS ELV
Product Type TF
Storage speed Conventional
Card installation method Self-eject type
Card insertion detection With detection PIN
Welding method Inner weld

Basic Parameters

Snap Gauge TF
Height Above Board 1.85mm
Card installation method PUSH PUSH Self-eject type
Locating Pin None
Foolproof Foolproof
Anti-Buckling Not Anti-Buckling
Hot Swap Support/Normally closed
Temperature resistance 260℃
Package SMD
Packaging Method Tape and Reel

Mechanical Properties

Durability 5,000Cycle

Electrical Characteristics

Withstand Voltage 500V AC
Insulation Resistance 1000MΩ Min
Contact Resistance 100mΩ Max
Rated Current 0.5A
Rated Voltage 50V
Declaration:About Product Specifications、Parameter、Life、Operating Temperature、Waterproof Rating and Other Data，Only Represents XunPuInternal Test Results，For Detailed Test Methods，Please Contact XunPuSales Representative。

Product Part Number List

Product Image Part Number Product Description Product Documentation Production Status PINNumber Card insertion detection Delivery Cycle Product Gross Weight MPQ MOQ Remarks Actions
TF-101B-ARP8 TF-101B-ARP8

View Drawings

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 		In Production 8PIN With detection 3-7Day 0.877Gram(g) 1000/plate No Restriction column-free Contact Customer Service

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Product Parameter Information

Basic Parameters

Snap GaugeTF
Height Above Board1.85mm
Card installation methodPUSH PUSH Self-eject type
Locating PinNone
FoolproofFoolproof
Anti-BucklingNot Anti-Buckling
Hot SwapSupport/Normally closed
Temperature resistance260℃
PackageSMD
Packaging MethodTape and Reel

Mechanical Properties

Durability5,000Cycle

Electrical Characteristics

Withstand Voltage500V AC
Insulation Resistance1000MΩ Min
Contact Resistance100mΩ Max
Rated Current0.5A
Rated Voltage50V