TF-107

REACH RoHS ELV

Product Type TF

Storage speed Conventional

Card installation method Tray type

Card insertion detection With detection PIN

Welding method Outer weld

Basic Parameters

Snap Gauge TF CARD

Height Above Board 1.35mm

Card installation method PIN PUSH Eject SIM card with pin

Locating Pin Yes

Foolproof Foolproof

Anti-Buckling Anti-collapse

Hot Swap Support/Normally open

Temperature resistance 260℃

Package SMD

Packaging Method Tape and Reel

Mechanical Properties

Durability 5,000Cycle

Electrical Characteristics

Withstand Voltage 500V AC

Insulation Resistance 1000MΩ Min

Contact Resistance 100mΩ Max

Rated Current 0.5A

Rated Voltage 50V

Declaration:About Product Specifications、Parameter、Life、Operating Temperature、Waterproof Rating and Other Data，Only Represents XunPuInternal Test Results，For Detailed Test Methods，Please Contact XunPuSales Representative。

Product Part Number List

Part Number	Product Documentation	Production Status	Delivery Cycle	Product Gross Weight	MPQ	MOQ	Actions
TF-107-ACP10	View Drawings 3DDownload	online	3~7Day	0.84Gram(g)	800/Disc	No Restriction	Contact Customer Service
TF-107-KT2	View Drawings	In Production	7~15Day			No Restriction	Contact Customer Service
TF-107-KT1	View Drawings 3DDownload	In Production	7~15Day	0.504Gram(g)	36pcs/tray	No Restriction	Contact Customer Service

Related Products

Product Parameter Information

Basic Parameters

Snap GaugeTF CARD

Height Above Board1.35mm

Card installation methodPIN PUSH Eject SIM card with pin

Locating PinYes

FoolproofFoolproof

Anti-BucklingAnti-collapse

Hot SwapSupport/Normally open

Temperature resistance260℃

PackageSMD

Packaging MethodTape and Reel

Mechanical Properties

Durability5,000Cycle

Electrical Characteristics

Withstand Voltage500V AC

Insulation Resistance1000MΩ Min

Contact Resistance100mΩ Max

Rated Current0.5A

Rated Voltage50V